- interconnect layer
- Микроэлектроника: коммутационный слой
Универсальный англо-русский словарь. Академик.ру. 2011.
interconnect layer
Смотреть что такое "interconnect layer" в других словарях:
layer — A group of functions that provide a defined set of communications services to a specific user. See also Open Systems Interconnect model … IT glossary of terms, acronyms and abbreviations
Intel QuickPath Interconnect — The Intel QuickPath Interconnect (QuickPath, QPI)[1][2][3] is a point to point processor interconnect developed by Intel which replaces the Front Side Bus (FSB) in Xeon, Itanium, and certain desktop platforms. It was designed to compete with… … Wikipedia
Link layer — In computer networking, the link layer is the lowest layer in the Internet Protocol Suite (commonly known as TCP/IP ), the networking architecture of the Internet (RFC 1122, RFC 1123). It is the group of methods or protocols that only operate on… … Wikipedia
Copper interconnect — Copper based chips are semiconductor integrated circuits, usually microprocessors, which use copper for interconnections. Since copper is a better conductor than aluminium, chips using this technology can have smaller metal components, and use… … Wikipedia
Intel QuickPath Interconnect — QuickPath Interconnect (kurz: QPI) ist eine von Intel entwickelte Punkt zu Punkt Verbindung für die Kommunikation zwischen Prozessoren untereinander und für die Kommunikation zwischen Prozessoren und Chipsatz. QPI ist im Gegensatz zu seinem… … Deutsch Wikipedia
Digital Ethernet Local Network Interconnect — A Digital Ethernet Local Network Interconnect (DELNI) The Digital Ethernet Local Network Interconnect (DELNI) was an Ethernet hub with nine ports and AUI connectors, made by Digital Equipment Corporation (DEC). Ports one to eight had male… … Wikipedia
Molded Interconnect Device — A Molded Interconnect Device is an injection molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the … Wikipedia
Atomic layer deposition — (ALD) is a gas phase chemical process used to create extremely thin coatings. The majority of ALD reactions use two chemicals, typically called s. These precursors react with a surface one at a time in a sequential manner. By exposing the… … Wikipedia
Open Systems Interconnect (OSI) layer 2 — The second layer of OSI, known as the data link layer; organizes data into frames and sequences for transfer across the physical layer. Layer 2 primarily detects and corrects message errors being transmitted across any physical link, and… … IT glossary of terms, acronyms and abbreviations
Bumpless Build-up Layer — or BBUL is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires. It has build up layers, because is grown / built up… … Wikipedia
Open Systems Interconnect (OSI) layer 4 — The fourth layer of OSI called the transport layer; recovers data that may have been lost due tonode failure on the lower network layers, and maps transport and network addresses. Layer 4 also establishes and manages reliable network… … IT glossary of terms, acronyms and abbreviations
